Job description
Our client is a leading semiconductor equipment company, develops leading edge assembly processes and equipment for lead frame, substrate and wafer level packaging applications. Specialized in high-speed epoxy and flip chip die bonding.
Job Description:
- Incremental development of software modules.
- Analyze customer issues and implement solutions within the existing machine application.
- Investigate and implement engineering change requests.
- Testing of new releases by unit testing, simulating processes and on actual equipment.
- Work with version control tools and issue tracking tool for software release management.
- Ensure fast response to customer issues.
- Install and (beta) test new software release at customer site within Asia region.
Requirements:
- BSc Degree in Automation/ Computer Science/ Mechatronics Engineering.
- At least 3-5 years relevant experience in Automation/ Equipment industries.
- Significant practical experience in software engineering and testing.
- Experience with agile software development processes, quality control and test driven development
- Good communication skills in a global environment.
- Result oriented with good analytical skills
- Team player, self organized and stress resistant.
- Affinity with mechatronic systems.
Expertise and Methodology:
- Proficiency in Microsoft .NET framework (C#, WCF, WPF) using Microsoft Visual Studio.
- Knowledge of UML and state machines.
- Very good English skills (verbal and written).
- Experience with version control in Mercurial / GIT is a pre.
- Experience with PLC language ST (IEC 6-1131) is a pre.
