Job description
Our client is a leading semiconductor equipment manufacturer, develops leading edge assembly processes and equipment for lead frame, substrate, and wafer level packaging applications. Specialized in high-speed epoxy and flip chip die bonding. Currently they are looking for a Software Engineer to join their dynamic team.
Job Description:
- New software feature design and implement for automation machine applications to enhance the product’s capability.
- Work with product specialists, hardware, and process engineers to develop new features.
- Software requirement analysis and documentation.
- Customer on-site software issue support.
- Customer specific software requirement analysis.
- Debugging on machine.
- Using version control and issue tracking tool for software release management and documentation.
Requirements:
- Bachelor’s degree in Automation, Mechatronics or Computer Science.
- Min 3 years broad experience in Software design and implementation using C++ under Windows environment.
- Experience in multi-tasking application development.
- Knowledge of software process, quality, version control and testing methodologies.
- Knowledge of the Semiconductor Backend industry is preferred.
- An understanding of mechanical systems, electronics or semiconductor packaging process will be an advantage.
Expertise and Methodology:
- Practical work in the laboratory on machine and measuring technology.
- Object-oriented programing knowledge.
- Conceptual and analytical thinking and systematic approach.
- Experience with Agile software development process will be an advantage.
Other Criteria:
- Teamwork and flexibility.
- Self-initiative and ability to work independently.
- Discipline, perseverance, and resilience.
- Good communication skills in a global environment.
